| Process | Capability | |||
| 2010 | 2011 | 2012 | ||
| Material |
Tg140/150/175 Halogen Free FR-4 Aluminum |
FR4 Tg150/175/200 Halogen Free FR-4 Aluminum |
FR4 Tg150/175/200 Halogen Free FR-4 Aluminum/Copper |
|
| Min. Dielectric Thickness | 2 mil | 2 mil | 2 mil | |
| Max. Layer Count | 24 | 30 | 34 | |
| Max. Finish Board Size | 22.0" x 27.0" | 22.0" x 29.0" | 22.0" x 29.0" | |
| Max. Board Thickness | .220¡¨ | .250¡¨ | .250¡¨ | |
| Min. Board Thickness | .020¡¨(6L) | .020¡¨(6L) | .016¡¨(6L) | |
|
Min.
Line/Space |
I/L | 3/3 mil | 2.4/2.4 mil | 2.4/2.4 mil |
| O/L | 3/3mil | 3/3 mil | 3/3 mil | |
| Warp | .005¡¨/in. | .005¡¨/in. | .005¡¨/in. | |
|
Process |
Capability |
|||
|
2010 |
2011 |
2012 |
||
|
Min. SMD Width |
8 mil |
8 mil |
8 mil |
|
|
Layer to Layer Registration |
4 mil |
4 mil |
4 mil |
|
|
Min. Finish Hole Size |
Mechanical Drill |
.005¡¨ |
.005¡¨ |
.005¡¨ |
|
Laser Drill |
.003¡¨ |
.003¡¨ |
.003¡¨ |
|
|
True Hole Position |
+/-.002¡¨ |
+/-.002¡¨ |
+/-.002¡¨ |
|
|
Finish Hole Size Tolerance |
PTH |
+/-.002¡¨ |
+/-.002¡¨ |
+/-.002¡¨ |
|
Non-PTH |
+/-.001¡¨ |
+/-.001¡¨ |
+/-.001¡¨ |
|
|
Aspect Ratio (Board Tks/FHS) |
9 |
10 |
12 |
|
|
Heavy Copper ( Inner Layer/Outer Layer) |
6 oz/7 oz |
6 oz/7 oz |
12 oz/7 oz |
|
|
Process |
Capability | ||
| 2010 | 2011 | 2012 | |
| Buried/Blind Via |
2+N+2 VIP-C & VIP-N |
3+N+3 VIP-C & VIP-N Stacked via |
3+N+3 VIP-C & VIP-N Stacked via |
| Back Drill Capability | No | No | Yes |
| Outline Tolerance | +/-.004¡¨ | +/-.004¡¨ | +/-.004¡¨ |
| Surface Finish |
HASL ENIG Immersion Silver OSP Carbon Immersion Tin Selective Gold Peelable S/M |
HASL ENIG Immersion Silver OSP Carbon Immersion Tin Selective Gold Peelable S/M |
HASL ENIG ENEPIG Immersion Silver OSP Carbon Immersion Tin Selective Gold Peelable S/M |
| ZO | +/-10% | +/-8% | +/-8% |
| SIR | Yes | Yes | Yes |
| CAF | 1000 hrs | 1200 hrs | 1200 hrs |