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 Technology Roadmap

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A : Investigation Stage   B : Developing Stage  C : Production Stage

Technology Topic

Item

Applicational

Current

Status

      2011

         2012

Q1

Q2

Q3

Q4

Q1

Q2

Q3

Q4

Heavy Cupper

O/L Copper

5 oz Cu

Power modules

C

C

C

C

C

C

C

C

C

I/L 7~12 

oz above

B

B

B

B

B

B

C

C

C

Bonable Gold Heavy Soft Gold COB B A B B B B C C C

High Layer Count

28~34 Layers

Server Back Panel

C

B

C

C

C

C

C

C

C

Advanced Material

Isola 370HR

Server Back Panel

B B B B B C C C C
ITEQ IT200LK

High frequency product  

B B B B C C C C C

Rogers 4-series

Microwave

RF product

C

B

B

B

B

C

C

C

C

Panasonic Megtron6

R-577 5K

High frequency product  

B A A A B B B C C

ITEQ IT150DA

IT150DA SL/L

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High frequency product

B

B

B

B

B

B

B

C

C

HDI

VIP-N

Epoxy Filled & copper plated Micro Via

HDI Products

C

B

C

C

C

C

C

C

C

Micro-Via DLD HDI Products C C C C C C C C C
Fine Line I/L 2.4/2.4 MIL

 HDI Products

B B B B C C C C C

Micro-Via

Stacked via

Mobile Phone

HDI Products

C

B

B

C

C

C

C

C

C

3 Build Up

Mobile Phone

HDI Products

C

B

B

C

C

C

C

C

C

Back Panel

Back Drill

Server

Back Panel

B

A

A

B

B

C

C

C

C

MCPCB

Cubase MCPCB

Power Module

B

A

B

B

B

B

C

C

C

M/L MCPCB

 Power Module

B

B

B

B

B

C

C

C

C

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