Item | Capability | |||
2023 | ||||
Material | FR4 | |||
Tg135~Tg200 | ||||
Halogen-Free FR-4 | ||||
Aluminum/Copper | ||||
Min. Dielectric Thickness | 2mil | |||
Max. Layer Counts | 50 | |||
Max. PCB Size | 22"x29" | |||
Max. PCB Thickness | 0.250" | |||
Min. PCB Thickness | 0.016"(6L) | |||
0.012"(2L) | ||||
Min Trace Width/Gap | Inner Layer | 1.6/2Mil | ||
Outer Layer | 2.0/2.0Mil | |||
Warpage & Twist | 0.003"/in. | |||
Min. SMD Pitch | 14mil | |||
Layer Registration | 4mil | |||
FHS | Mechanical | 0.004" | ||
Laser | 0.003" | |||
Drill Hole Position | +/-.002" | |||
Hole Size Tolerance | PTH | +/-.002" | ||
NPTH | +/-.001" | |||
Aspect Ratio | (Thickness/FHS) | 33 | ||
Max. Copper | Inner Layer | 12 OZ | ||
Outer Layer | 8 OZ | |||
Blind/Buried Via | 1+1+1+1+N+1+1+1+1 | |||
VIP-C &VIP-N | ||||
Stacked via、
Staggered vias |
||||
Back Drill | +/-2mil | |||
PCB Profile Tolerance | +/-3mil | |||
Surface Finished | HASL/Lead-Free | |||
ENIG | ||||
ENIG w/ pd | ||||
Immersion Silver | ||||
OSP | ||||
Carbon Ink | ||||
Immersion/Electrical Tin | ||||
Selective/Full Body Gold | ||||
Peelable | ||||
Immpedance Control | +/-5% | |||
Special process |
Coin inlay、Copper paste plugged hole |