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Capability

Item Capability
2018
Material FR4
Tg135~Tg200
Halogen-Free FR-4
Aluminum/Copper
Min. Dielectric Thickness 2mil
Max. Layer Counts 46
Max. PCB Size 22"x29"
Max. PCB Thickness 0.250"
Min. PCB Thickness 0.016"(6L)
0.012"(2L)
Min Trace Width/Gap Inner Layer 2.0/2.0Mil
Outer Layer 2.4/2.4Mil
Warpage & Twist 0.003"/in.
Min. SMD Pitch 14mil
Layer Registration 4mil
FHS Mechanical 0.004"
Laser 0.003"
Drill Hole Position +/-.002"
Hole Size Tolerance PTH +/-.002"
NPTH +/-.001"
Aspect Ratio (Thickness/FHS) 33
Max. Copper  Inner Layer 12 OZ
Outer Layer 8 OZ
Blind/Buried Via 1+1+1+1+N+1+1+1+1
VIP-C &VIP-N
Stacked via
Back Drill Yes
PCB Profile Tolerance +/-.004"
Surface Finished HASL/Lead-Free
ENIG
ENIG w/ pd
Immersion Silver
OSP
Carbon Ink
Immersion/Electrical Tin
Selective/Full Body Gold
Peelable
Immpedance Control +/-5%