| Item | Capability | |||
| 2023 | ||||
| Material | FR4 | |||
| Tg135~Tg200 | ||||
| Halogen-Free FR-4 | ||||
| Aluminum/Copper | ||||
| Min. Dielectric Thickness | 2mil | |||
| Max. Layer Counts | 50 | |||
| Max. PCB Size | 22"x29" | |||
| Max. PCB Thickness | 0.250" | |||
| Min. PCB Thickness | 0.016"(6L) | |||
| 0.012"(2L) | ||||
| Min Trace Width/Gap | Inner Layer | 1.6/2Mil | ||
| Outer Layer | 2.0/2.0Mil | |||
| Warpage & Twist | 0.003"/in. | |||
| Min. SMD Pitch | 14mil | |||
| Layer Registration | 4mil | |||
| FHS | Mechanical | 0.004" | ||
| Laser | 0.003" | |||
| Drill Hole Position | +/-.002" | |||
| Hole Size Tolerance | PTH | +/-.002" | ||
| NPTH | +/-.001" | |||
| Aspect Ratio | (Thickness/FHS) | 33 | ||
| Max. Copper | Inner Layer | 12 OZ | ||
| Outer Layer | 8 OZ | |||
| Blind/Buried Via | 1+1+1+1+N+1+1+1+1 | |||
| VIP-C &VIP-N | ||||
| Stacked via、
Staggered vias |
||||
| Back Drill | +/-2mil | |||
| PCB Profile Tolerance | +/-3mil | |||
| Surface Finished | HASL/Lead-Free | |||
| ENIG | ||||
| ENIG w/ pd | ||||
| Immersion Silver | ||||
| OSP | ||||
| Carbon Ink | ||||
| Immersion/Electrical Tin | ||||
| Selective/Full Body Gold | ||||
| Peelable | ||||
| Immpedance Control | +/-5% | |||
|
Special process |
Coin inlay、Copper paste plugged hole |
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